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Home > New Gear > 3rd Generation AMD Ryzen Processors: All details uncovered
3rd Generation AMD Ryzen Processors: All details uncovered

3rd Generation AMD Ryzen Processors: All details uncovered

By  Jordan Hobbs 2019-06-12 483 0

Now we have the third generation of AMD Ryzen processors that, in addition, releases Zen 2 architecture with a new manufacturing process of 7 nanometers and chiplet design that introduces, for the first time in history, 16-core processors for the mainstream range. All this with a clear objective: to surpass Intel even in environments that could be favorable such as gaming.

Things couldn't be more interesting for hardware lovers. Let's take a closer look at what this third generation of AMD Ryzen processors will bring us.

AMD Ryzen Third Generation CPU Specifications and Pricing

First of all, let's get to know the different models that will make up the new family of third generation AMD Ryzen processors.

We started with the most powerful, the AMD Ryzen 9 3950X, a model that surprises with nothing more and nothing less than 16 real cores and 32 threads, becoming the first mainstream processor to reach such a number of cores.

In fact, until now, the largest number of cores found in this range were the 8 cores that could offer processors such as the AMD Ryzen 7 2700X or the Core i9-9900K. Above that figure we had to go to the Intel (LGA 2066) and AMD (TR4) HEDT enthusiasts platforms.

This Ryzen 9 3950X will have a base speed of 3.5 GHz and will reach Boost speeds of 4.7 GHz, all with 72 MB of Cache in total and a TDP of 105W. Its price, at least for the moment, is a mystery, although we do know that it will reach the market after the summer, in September.

This CPU will be just above the AMD Ryzen 9 3900X, a processor that, while not reaching 16 cores, also manages to stand out by offering 12 cores and 24 threads, all with a base speed of 3.8 GHz and 4.6 GHz Boost. It comes with a total of 70 MB cache and a 105W TPD. It will cost $499 and will arrive in stores on July 7.

Model

Architecture

Manufacturing Process

Cores/Threads

MHz Base/Boost

Cache

PCI Express

TPD

Platform

GPU

Price

AMD Ryzen 9 3950X

Zen 2

7 nm

16/32

3.5/4.7 GHz

72MB

4.0

105W

AM4

No

$749

AMD Ryzen 9 3900X

Zen 2

7 nm

12/24

3.8/4.6 GHz

70MB

4.0

105W

AM4

No

$499

AMD Ryzen 7 3800X

Zen 2

7 nm

8/16

3.9/4.5 GHz

36MB

4.0

95W

AM4

No

$399

AMD Ryzen 7 3700X

Zen 2

7 nm

8/16

3.6/4.4 GHz

36MB

4.0

65W

AM4

No

$329

AMD Ryzen 5 3600X

Zen 2

7 nm

6/12

3.8/4.4 GHz

35MB

4.0

95W

AM4

No

$249

AMD Ryzen 5 3600

Zen 2

7 nm

6/12

3.6/4.2 GHz

35MB

4.0

65W

AM4

No

$199

AMD Ryzen 5 3400G

Zen+

12 nm

4/8

3.7/4.2 GHz

6MB

3.0

65W

AM4

Vega 11

$149

AMD Ryzen 3 3200G

Zen+

12 nm

4/4

3.6/4.0 GHz

6MB

3.0

65W

AM4

Vega 8

$99

Both the AMD Ryzen 7 3800X and the Ryzen 7 3700X will be maintained with 8 cores and 16 threads, an amount identical to the current 2700 and 2700X. In this case, the differences between the two are in the operating speeds and also in the TDP.

The Ryzen 7 3800X operates at 3.9 GHz Base and 4.5 GHz Boost with a TDP of 95W, while the Ryzen 7 3700X operates at 3.6 GHz and 4.4 GHz with a TDP of less than 65W. Both processors share a total of 36 MB of cache and will be priced at $399 and $329 respectively. They'll hit the market in July.

Entering the "middle" range, we have the AMD Ryzen 5 3600X and Ryzen 5 3600, processors with 6 cores and 12 threads of Zen 2 architecture. The 3600X operates at 3.8 GHz base and 4.4 GHz Boost, while the Ryzen 5 3600 does it at 3.6 and 4.2 GHz. The TDP of the Ryzen 5 3600X rises to 95W while the TDP of the Ryzen 5 3600 remains at 65W. Their prices will be of 249 and 199 Dollars respectively.

All of these processors support PCI Express 4.0.

Finally, AMD has taken the opportunity to update its range of APUs with Vega integrated graphics by incorporating them into this third generation.

As with the second generation, in the APUs family the CPU cores are one generation behind, so in this case we are talking about Zen+ architecture at 12 nanometers instead of Zen 2 at 7 nm.

The AMD Ryzen 5 3400G includes four cores and 8 threads running at 3.7 GHz Base and 4.2 GHz Boost along with 6 MB cache and a 65W TDP. Its price is 149 Dollars and incorporates a Vega 11 graphic at 1.400 MHz.

On the other hand, we have the AMD Ryzen 3 3200G with four cores and four wires at 3.6 GHz base and 4 GHz Boost. It has a Vega 8 graph at 1.250 MHz and a TDP of 65W. Its price will be $99.

This will be, in short, the entire range of AMD Ryzen third generation processors, at least at the time of its launch which will take place on 7 July this year, although for the Ryzen 9 3950X we will have to wait until September.

Chiplet Design

The third-generation Ryzen are manufactured following a chiplet design, i.e. different parts of the CPU have been split and interconnected, so that different manufacturing processes can be used and follow a much more modular and scalable design.

In the case of these processors, we have that the processor is actually divided into three chiplets interconnected by the second generation of Infinity Fabric technology.

In the following photo it can be clearly seen:

We have two chiplets for the part of the CPU cores along with their cache and a third for input/output tasks.

The two main CCDs each have two modules of 4 cores each accompanied by 16 MB of L3 cache (32 MB in total), that is to say, in each CPU chiplet we have 8 cores as maximum and depending on the processor we will have active or functional the necessary cores. In the case of the Ryzen 9 3950X we will have all cores and caches activated and in the case of a Ryzen 7 2700X, for example, we will have half, probably 4 in each CCD.

The third Chiplet is located below the two CCDs and is responsible for interconnecting everything through the Infinity Fabric module and also manage the tasks of Input and Output, ie in that chiplet (cIOD), we have memory controllers, PCI Express 4.0 controllers for GPU, NVMe, SATA, etc, and also USB 3.1 connections of 10 Gbps. The third Chiplet is located below the two CCDs and is in charge of interconnecting everything through the Infinity Fabric module and also manage the tasks of Input and Output, ie in that chiplet (cIOD), we have memory controllers, PCI Express 4.0 controllers for GPU, NVMe, SATA, etc, and also USB 3.1 connections of 10 Gbps.

In fact, this I/O module is the same we can find in the X570 chipset.

An eye-catching theme but, really, it is what demonstrates the advantage of the chiiplet system, is that CCDs with cores are manufactured at 7 nanometers in TSCM and cIODs with input/output tasks are manufactured at 12 nanometers in Globalfoundries.

Then they all connect under the same PCB and we already have a functional third generation Ryzen processor.

However, not everything is so simple because, having modules manufactured at different nanometers, the union and welding between the tracks of the pcb and the different chips has different measures and methods of union.

For example, the 12 nanometer chips use direct welding strokes (tin on the pcb and contacts) with a size between 75 and 150 microns.

But the chiplets manufactured at 7 nanometers (CCD in this case), use a system based on a copper pillar (pin) on which the solder is placed. The abutment system is more compact and allows a homogeneous die height. In fact, its size is only 50-100 microns.

So AMD has had to port the copper pillar system to 12 nanometer chiplets (which generally use direct soldering) to have a common interface.

At the PCB level, AMD has had to use new materials due to the requirements of technologies such as PCI Express 4.0, as greater rigour is required in terms of lossless signal transmission.

In addition, all this new chiplet design has had to be adapted in such a way that pin to pin compatibility with the AM4 socket is maintained.

One of the effects of this adaptation is that all the PCB tracks have had to be designed, so that the socket pins correspond, and it should not be forgotten that the arrangement of the processor components has been moved to 3 separate zones.

So AMD has used a 12-layer PCB system, along with a common structure that applies to both 1 CCD and 2 CCD processors.

In the following slide you can get an idea of the complex design of the interconnection between the chiplets and the socket through the PCB.

What's new in Zen architecture 2 to 7 nanometers

Third-generation Ryzen AMDs unveil a new iteration of AMD's Zen architecture. After the launch of Zen, followed by its Zen+ review, Zen 2 is one of the most important leaps in this new architecture that gives way to the 7 nanometers of TSMC and that, if everything goes according to plan, will be the predecessor of Zen 3 before 2021.

Zen 2, apart from the new manufacturing process that places it as the first high-performance processor x86 at 7 nanometers, also introduces improvements in the cores of the CPU along with new security features and a chiplet design joined by Infinity Fabric technology.

The 7 nanometers multiply the density by two while reducing the energy needed to maintain the same performance or, if you want to increase the performance, allows an increase of 1.25X while maintaining consumption.

Being such a small manufacturing node, TSMC had to use four lithographic masks in order to create these processors.

At the architecture level, Zen 2 introduces important improvements in the management of the L3 cache. In fact, the most important change is that, directly, the L3 cache that each kernel has is multiplied by two, with 4 MB of L3 cache per kernel accompanied by 512 KB of L2 cache.

This means interesting improvements in gaming performance and also helps reduce memory latencies. In addition, new instructions for caching processor data are included.

The loading and storage capacity of the L1 cache has been doubled, at the same time as the Throttling of prefetch has been improved, that is, of those operations that are predicted to be necessary.

The private L2 cache is now 512 Kb as mentioned above, and also faster.

The SMT allowing 2 threads per kernel is maintained, in addition, the micro operations cache now supports 4K instructions.

A new Fetch instruction prediction system has been introduced along with 32 KB of 8-way L1l cache to improve prediction and utilization of these caches.

The floating-point computing unit now has twice the bandwidth, from 128 bits to 256 bits.

In addition, it is optimized to use logs of that capability to improve performance, along with improved latency that drops from 4 cycles to 3 cycles.

The integer part of the calculation has gone from 84 planners to 92, with 180 physical entries in the register.

At CPU performance level, AMD ensures that the increase over Zen+ is 21% extra. Of that 21% increase in performance, 60% comes from improvements in the IPC (instructions per clock cycle) and the remaining 40% is derived from the 7 nanometer process and the operating frequencies it allows.

When it comes to security, Zen 2 is immune to vulnerabilities such as Spectre and Spectre V4 directly via hardware.

Moreover, by inheriting the architecture of Zen, vulnerabilities such as Meltdown, Foreshadow, Lazy FPU or Spoiler do not affect it.

Performance

As we prepare the review that we will publish on July 7th to show you what these processors are capable of, AMD has given us some performance details so that we can get an idea of what they will be capable of.

Because of their larger number of cores, the performance of these processors is already assumed to be excellent for tasks that take advantage of multi-thread processing as rendering or performing multiple tasks at once (e.g., playing, editing, and streaming at the same time). In addition, AMD has placed special emphasis on the gaming performance of the third generation of Ryzen processors.

These performance improvements are fueled by the fact that Zen 2 doubles the amount of L3 cache and reduces effective memory latency by 33 ns, resulting in 21% more gaming performance.

This means that interesting performance improvements can also be achieved with faster memories. For example, moving from DDR4 to 2667 MHz to DDR4 memory to 3600 MHz can increase gaming performance by 10%.

In fact, these third-generation Ryzen will support memories at a faster rate than the previous generation. We can see some tests where we have achieved speeds of 5.100 MHz by air, a whole logo taking into account the limitations of previous ryzen processors.

The general increase of IPC (instructions per clock cycle) of Zen 2 is an improvement of 15% compared to the last generation, this makes the performance increase both in multithreaded applications as in those that require a single core to work, since, in any case, the processor is able to handle more instructions per cycle.

For example, in the 1-core Cinebench tests, the improvement between a Ryzen 7 2700X and a Ryzen 9 3900X is 21% more performance.

Returning to games, at 1080p AMD places the Ryzen 9 3900X at the height of the Core i9-9900K directly, Intel's flagship in the same range. Both processors would offer a very similar performance, in some cases as CS:Go or COD: Black Ops III would win the Ryzen 9 3900X and in others as Overwatch or Devil MayCry 5, the Intel solution would be put ahead.

In any case, they would be almost invaluable differences in FPS rates that exceed 200 in many cases, and all this without forgetting that the Ryzen 9 3900X offers more cores than the Core i9-9900K, so in tasks that take advantage of that capacity, we would have an advantage.

In the case of the AMD Ryzen 7 3800X vs Core i7.9700K, we can see that at 1080p the results are similar to the previous ones, with very even yields.

The same is true for the Core i5-9600k vs Ryzen 5 3600X

Another detail where AMD wants to highlight the advantage of its third-generation Ryzen against its competitor has been in terms of energy efficiency. According to AMD itself; a Ryzen 9 3900X offers 58% more performance per watt than a Core i9-9900K. In fact, with all kernels enabled in Cinebench R20, the Core i9-9900K consumes over 205W while the Ryzen 9 stays at about 190W.

Compared to the same processor, AMD ensures that in content creation tasks, the Ryzen 3 3900X offers 47% more performance than the Intel® alternative.

A detail to comment is that all these tests have been made with the previous version of Windows and, precisely, the latest major update of Windows 10 introduces improvements that can extend the performance of the third generation Ryzen.

In fact, the latest update makes the change between processor speeds 20 times faster.

Conclusion

Gone are the days when a single manufacturer dominated the processor market. Today, AMD can not only stand up to Intel, but in this presentation of the third-generation Ryzen processors have shown an innovative role being the first to integrate a chiplet design into high-performance processors and are also pioneers introducing the 7 nanometers on this platform.

Not only that, the Ryzen 9 3950X (and also the Ryzen 9 3900X) represent a revolution in the mainstream market of processors to get chips of up to 16 cores, making access to the capabilities offered by such a number of threads is not limited only to the highest ranges of HEDT platforms such as Intel LGA 2066 or the TR4 itself of the Ryzen Threadrriper AMD.

We can not talk about performance beyond the data offered by AMD itself where one guesses a clear interest in overcoming Intel in fields such as gaming where they still held the head of the pack. AMD has placed this entire range of third generation Ryzen processors directly against the ninth generation Intel Core, marking one by one with its new launches the offer of its main competitor and playing with the trick of a greater number of cores and more aggressive prices.

However, we'll have to wait for different tests to see what they offer in real-world performance. What is certain is that AMD is in a sweet spot and, in the end, competition is the best we can ask consumers to see innovation and competitive prices.

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