ComputeX 2019 AMD announces a number of new generation products
By Ingrid Wilhelmina 2019-05-28 301 0
1. The new “Zen 2” core has greatly improved the performance improvement level of product generations in the industry. IPC (instructions per clock cycle) is expected to increase by up to 15% compared to the “Zen” architecture. The newly designed "Zen 2" processor core brings significant upgrades to the next-generation AMD Duron and EPYC processors, including larger cache capacities and new floating point units.
2, the third generation AMD Ruilong desktop processor series, including the new 12-core Ruilong 9 series processor, will provide top performance.
3, AMD X570 chipset is the world's first chipset supporting PCIe4.0, using socket AM4 architecture, more than 50 new motherboards will be released in the same period.
4. The RDNA game architecture is designed to drive the future of computer games, game consoles and cloud computing, and is expected to deliver incredible performance, power consumption and memory efficiency improvements in smaller packages.
5, 7nm AMD Radeon RX 5700 series game graphics series, with high-speed GDDR6 memory, support PCIe 4.0.
Also attending Dr. Lisa Su were Roanne Sones, Vice President of Microsoft Platforms, Xie Mingjie, Chief Operating Officer of ASUS, Jerry Kao, AOC's Chief Operating Officer, and other key industry technology leaders who together demonstrated AMD's high performance computing and graphics ecosystem. The far-reaching impact.
Dr. Lisa Su said: "The 2019 is an incredible start for AMD. AMD celebrates its 50-year innovation journey by launching a number of leading products, and continues to challenge the limits of computer and graphics technology. AMD A new generation of core, breakthrough single-package modular chipset and advanced process technology have made a major strategic investment, bringing advanced 7nm process products to the company's high-performance computing ecosystem. When the Dragon Desktop Processor, EPYC server processor and Radeon RX game graphics are on the market, we are very excited to start the 2019 Taipei International Computer Show with industry partners.
AMD high performance desktop products
Leading the PC industry, AMD unveiled the world's leading third-generation Rex desktop processor with groundbreaking performance in gaming, productivity and content creation applications. The third-generation AMD Ruilong desktop processor based on the new "Zen 2" single-package modular chiplet is expected to deliver unprecedented core cache performance to unlock elite gaming kinetics. In addition, the entire third-generation AMD Ruilong desktop processor has been fully supported by the world's first PCIe 4.0 interface, providing extremely advanced motherboard, graphics and storage technology to create a new performance benchmark and provide the ultimate consumer Experience.
AMD also created a new Ruilong 9 series product line for the third-generation Ruilong desktop processor. Its flagship model is 12-core/24-threaded Ruilong 9 3900X, which will continue to promote high-performance Socket AM4 with its outstanding performance. Platform architecture. AMD also improved the 8-core Ruilong 7 series and the 6-core Ruilong 5 series.
In the keynote speech, Dr. Lisa Su also conducted several on-site product demonstrations to highlight the leading performance of the third-generation AMD Ruilong desktop processor.
AMD introduced the world's first new X570 chipset supporting PCIe 4.0 interface for Socket AM4 platform. The storage performance will be 42% faster than PCIe 3.0. It fully supports PCIe products such as high-performance graphics cards, network devices and NVMe hard disks. Motherboards based on the AMD X570 chipset will double the bandwidth of PCIe 3.0 motherboards, and computer enthusiasts can achieve higher performance and flexibility when building custom systems. The X570 chipset will create an unprecedented open ecosystem for AMD. ASRock, Asus, Colorful, Gigabyte, MSI and other card partners are expected to launch more than 50 new X570 motherboards, while partners such as GALAXY, Gigabyte and Synapse will also launch a new PCIe 4.0 storage solution. The third-generation AMD Ruilong desktop processor is expected to be available worldwide on July 7, 2019.
In addition, many well-known OEMs and system integrators including Acer, Asus, CyberPowerPC, Hewlett-Packard, Lenovo and MainGear will also announce their game desktop platform plans based on the third-generation AMD Ruilong desktop processor in the coming months. To continue to enhance the powerful ecosystem built on this new platform.
AMD high performance gaming products
AMD also launched a new generation of basic game architecture - RDNA, designed to drive the development of computer games, game consoles and cloud games in the coming years. RDNA is designed with a new computing unit that is expected to deliver incredible performance, power and memory efficiency in a smaller package compared to the previous generation GCN graphics core architecture. Compared to the GCN graphics core architecture, RDNA is expected to deliver up to 1.25 times per clock performance and up to 1.5 times per watt performance, providing better gaming performance with lower power consumption and lower latency.
Upcoming 7nm AMD Radeon RX 5700 series graphics card with RDNA architecture, with high-speed GDDR6 memory and support for PCIe 4.0 interface.
In his keynote speech, Dr. Lisa Su demonstrated strong performance RDNA, and on the spot using a graphics card AMD Radeon RX 5700 show "Amazing squad" graphics performance (Strange Brigade) game demo of its incredible performance, achieve per second About 100 frames.
The AMD Radeon RX 5700 series graphics card is expected to be available in July 2019. Please find more details on the AMD E3 live event at 3 pm Pacific Time on June 10, 2019.
AMD Data Center Products
AMD's data center business continues to win customers' favor, deploying and deploying from the largest cloud environments to tens of billions of supercomputing workloads, and the huge market facing AMD EPYC and AMD Radeon Instinct processors Benefit from opportunities.
In the keynote speech, Dr. Lisa Su first publicly conducted a comparative demonstration of the second-generation AMD EPYC server platform, which continues to arouse expectations for the next generation of EPYC processors.
Finally, AMD and Microsoft Azure announced the use of Azure HB cloud instances running on systems based on the first generation of AMD EPYC processors to achieve computational fluid dynamics (CFD) performance levels previously unavailable. Utilizing the outstanding memory bandwidth of AMD EPYC, Azure HB uses Le Mans 100 million unit simulations to extend the Siemens Star -CCM + application on more than 11,500 cores, far exceeding the 10 never reached before. 000 core goals. Navneet Joneja, head of Microsoft's Azure virtual machine product, said: "The HB series of virtual machines (VMs) on Azure have changed the rules of high-performance computing (HPC) on the cloud. The first time HPC customers can extend their MPI workloads to numbers. With 10,000 cores and cloud flexibility, performance and economy comparable to locally deployed clusters, we expect this new Azure cloud instance to make a significant contribution to HPC-driven innovation and productivity."
Compared to the previous generation, the second-generation AMD EPYC server processor family will deliver up to 2x performance per slot and up to 4x floating point performance.
The second-generation AMD EPYC server processor series is expected to be available in the third quarter of 2019.
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