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Home > New Gear > UFS 3.0 is a Flash memory standard that promises to improve smartphone performance
UFS 3.0 is a Flash memory standard that promises to improve smartphone performance

UFS 3.0 is a Flash memory standard that promises to improve smartphone performance

By  Daniel Camilo 2019-05-16 1815 0

We always pay attention to the processor and the amount of RAM to estimate how fast a smartphone is, but the standard of data storage also influences performance. In a few months, we will have devices with a much faster and more economical type of flash memory in energy consumption than today's standards: JEDEC, the entity responsible for the standardization of microelectronics, has completed the specifications of UFS 3.0.

What is UFS?

Universal Flash Storage, officially abbreviated as UFS, is a flash storage specification for digital cameras, mobile phones and consumer electronic devices. It aims to bring higher data transfer speed and increased reliability to flash memory storage, while reducing market confusion and removing the need for different adapters for different types of card. In addition, the Linux kernel supports UFS.


UFS version comparison

It is more common in high-end devices. Currently, the industry is served by standards UFS 2.0 (from 2013) and UFS 2.1 (2016). The latter can be found in OnePlus 5T and Galaxy S8 , for example (although many S8 units have UFS 2.0 , apparently).

UFS 2.1 is fast enough to eliminate almost every type of bottleneck. The new standard goes much further, promising double performance: while UFS 2.1 supports bandwidth up to 5.8 Gb / s (gigabits per second) per channel, UFS 3.0 supports up to 11.6 Gb / s. Since UFS 3.0 allows the use of two simultaneous channels (as well as 2.0 and 2.1), the bandwidth can reach 23.2 Gb / s, that is, at a theoretical maximum of 2.9 GB / s (gigabytes per second).













Bandwidth per lane

300 MB/s

600 MB/s

1450 MB/s

Max. number of lanes



Max. total bandwidth

300 MB/s

1200 MB/s

2900 MB/s

M-PHY version





UniPro version





UFS 2.0 chip (3.0 modules will be smaller)

In power consumption, UFS 2.1 requires between 2.7 V and 3.6 V. Thanks to the reduced chip area, UFS 3.0 can handle 2.5 V. In summary: modules in the new standard help the device to save energy.

Another advantage of the UFS 3.0 standard is the broader support for temperature variations: between -40 ° C and 105 ° C. The ability of UFS 3.0 modules to work with these extremes is not a whim: JEDEC expects chips of the type used by the automotive industry.

With respect to smartphones and other mobile devices, the first UFS 3.0-equipped models may hit the market later this year, but the odds are slim. There are some rumors about the use of the standard in the future Galaxy S9, but we're more likely to see the technology only in line tops launched from 2019.

 You may also want to read:
The best way now to format any SD memory card safely and quickly
Dos and don’ts about dash cam memory cards
More understanding about phone's memory - RAM and ROM

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