Xiaomi mi 10 Pro teardown: What is the internal structure of Xiaomi mi 10 Pro?
By Bing Hastings 2020-02-19 2897 29
When you open the back cover of the fuselage, the first thing you can see is the double-layer heat-conducting graphite that covers almost the entire motherboard area. The top of the phone is covered with NFC coils and wireless charging coils, and the top and bottom of the phone are symmetrically arranged with double 1216 superlinear loudspeakers. Take apart the cover of the motherboard on the left, you can see that the motherboard and the battery are distributed around, the motherboard area adopts the design of double-layer motherboard, and the 4500mAh large-capacity battery on the right side occupies most of the internal space and is fixed on the middle frame by easy-to-tear paste.
Take apart the rear camera protection cover and you can see the full picture of 100 million quad camera, and the one that takes up the most space in the middle is the 100 megapixel main camera. According to officials, the Xiaomi 10 Pro 4500mAh battery uses pole-ear middle technology, combined with a long custom design can greatly reduce the overall impedance and reduce energy loss and heat generation during the fast charging process. Under the battery is the optical fingerprint module under the ultra-thin screen.
Xiaomi 10 Pro disassembly diagram.
In other aspects, the front camera is an ultra-small 20 million-pixel miniature lens, the motherboard uses an L-shaped special-shaped motherboard, and the shield is covered with copper foil and heat-conducting graphite. The upper part of the front of the motherboard is the WiFi 6 chip, the middle is the power management chip and audio decoding chip, and the lower part is the radio frequency chip. The back is lined with Qualcomm Snapdragon865+LPDDR5 flash stack, X55 baseband, and UFS 3.0 flash memory from top to bottom.
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